Provide customers with one-stop service from wafer manufacturing to power module packaging and testing, including IGBT module, MOSFET IPM module, DFN Cu clip and other system-level integrated packaging.

UNT can provide customized process development and mass production solutions for customers. Wafer level traceability and die level traceability for automotive product can also be supported.

Customers’products are widely used in consumer electronics, industrial invertors and convertors, home appliances, electric vehicles, smart grid, wind power and solar energy and etc.